产品结构：硅台面型塑料封装，单只重量约1.5克。
特点：◆管芯与引出端采用熔焊键合。
◆瞬时过载能力强。
质量等级及执行标准：
◆国标ⅱ类“j”
gb4589.1-89 gb/t12560-1999 q/fr191-2007
主要用途：在电子线路中作过压保护。
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